PROCESS CAPABILITIES

FEATURE                              TYPICAL                  TECHNOLOGY                

Layer Count                               10                                 24

Component Pitch                      .025                              .015

Conductor Width Internal          .005                              .0035

Conductor Space Internal          .005                              .004

Conductor Width External          .005                              .004

Conductor Space                       .005                              .004

Finished Board Thickness           .062                              .200

Hole Diameter                            .013                              .008

Panel Sizes                               18x24                            24X26

Aspect Ratio                               6:1                               10:1

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Last modified: September 07, 2008