CIRTECH MANUFACTURING SERVICES

BOARD LEVEL ASSEMBLY :

·        Proto-type

·        Low volume to Mid volume Production

·        Double-side SMT + Thru-Hole

·        Consignment or Full Turnkey

SERVICES :

·        Surface Mount Technology

·        Thru-Hole assembly

·        Mixed-technology SMT and Thru-Hole

·        Electro-mechanical assembly

·        Small parts Assembly and Soldering

·        Terminal Assembly

·        Connector and press-fit assembly

CAPABILITIES :

SMT AND THRU-HOLE :

Automated Surface Mount placement using vision alignment

Can place 0402 packages to 2512 packages

Fine Pitch component

BGA (ball grid array) and micro BGA placement

X-Ray machine for BGA inspection

Wave solder

SMT AND THRU-HOLE EQUIPMENT LIST :

AMISTAR PLACE-PRO FV7100

ELITE E6920 PRECISION SCREEN AND STENCIL PRINTER

CONCEPTRONICS REFLOW OVEN

ELECTROVERT ECONOPAK II WAVE SOLDER MACHINE

AIR VAC SOLDER POT

FEIN FOCUS X-RAY MACHINE

AQUEOUS TECH BOARD WASHER

Send mail to jrocha@cirtech.com with questions or comments about this web site.
Last modified: October 29, 2007